 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| CALIFORNIA MICRO DEVICES 210R THIN FILM RESISTOR SERIES California Micro Devices 210R Series multi-terminal resistor chip offers the hybrid designer a component that provides a wide range of resistance values on a single chip. Bonding pads segment the total resistance into five single elements of resistance and seven 5X elements of resistance enabling the combination to cover the resistance range from 800 ohms to 240K ohms. Parameter TCR Operating Voltage Package ating per re Power RPower(Rating sistor) Thermal Shock High Temperature Exposure Moisture Resistance Life Noise Insulation Resistance ELECTRICAL SPECIFICATIONS Test Condition -55C to +125C -55C to +125C @ 70C (D erate linearly to zero @ 150 C ) Method 107 MIL-STD -202F 100 Hrs @ 150 C A m b i e n t Method 106 MIL-STD -202F Method 108 MIL-STD -202F (125 C / 1 0 0 0 h r ) Method 308 MIL-STD -202F @ 25 C 0 to -250ppm/C 100Vdc 250mw 0.25% @ R 0.25% R 0.5% R 0.5% R -20dB 1 x 1 0 12 Max Max Max Max Max Max Max Max Min PAD 1 PAD 13 PAD 8 Part Number 2 10 R 2 10 R 2 10 R 2 10 R 2 10 R 2 10 R 8000X 2 40 0 X 8 0 0 1X 8002X 16 0 2 X 2 40 3 X VALUES Total Nominal/Single Resistance Element of Resistance 800 2 400 8000 80000 16 0 0 0 0 2 40 0 0 0 20 60 200 2000 40 0 0 6000 Formats Die Size: 303 mils square Bonding Pads: 4x4 mils typical MECHANICAL SPECIFICATIONS Substrate Isolation Layer Backing Metalization Silicon 102 mils thick Si02 100,000A thick, min Lapped (gold optional) Aluminum 10,000A thick, min (15,000A gold optional) PACKAGING Two inch square trays of 400 chips maximum. NOTE S 1. The tolerance applies to the total resistance value only. 2. Resistor pattern may vary from one value to another. 210R Series 8502 Value First 3 digits are significant value. Last digit represents number of zeros. R indicates decimal point PART NUMBER DESIGNATION X G Tolerance J = 5% K = 10% M = 20% Bond Pads G = Go l d No Letter = Aluminum Backing W = Go l d L = Lapped No Letter = Either W (c) 2002 California Micro Devices Corp. All rights reserved. 3/02 C0740400 215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com |
Price & Availability of 210R8002X
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |